The image recognition system corrects each wafer after it has been removed from the wafer cassette and moved to the tray. You can choose from a variety of operating modes.

Target2 - 4 inch wafers       
Capacity60 sec/wafer (image processing time within 5 seconds)
Wafer CorrectionPosition correction by image recognition machine
External Dimensions1500(W)x950(D)x1850(H)