After image processing has corrected the alignment lines on a quartz wafer, this technology measures the chips inside the wafer. There are optional parameters for specified ID (region), sampling inspection, and total inspection.
| Target Product | Crystal Oscillator |
| Capacity | Approx. 1.5 sec/4 pieces (at a measuring time of 0.6 sec/piece). |
| Control | PLC & PC |
| Measurement Device | 250B-2 (S&A product) |
| Contact | Multi-layered precision contacts for ultra-small pitches |
| Measurement | Frequencies and CI values, etc. |
| Measurement Data Output | Mapping on the monitor, CSV file |
| External Dimensions | 900(W) x 800(D) x 2000(H) |
