An automatic polishing controller that uses a microprocessor to measure the resonance frequency while polishing, monitor it as the piezoelectric material is being lapped and polished, and stop the operation when the desired frequency is reached.
Nearly every 2-way or 4-way polishing machine made by any manufacturer may use it.
| Target Product | Control device for silicon wafer polishers |
| Control Thickness Range | 100 - 1600 φm |
| Measurement Precision | 0.1 % |
| WR Probe | 3.5 MHZ - 99 MHz |
| Reproducibility | 100 ppm MHz |
| Exterior Dimensions | 290(W)x290(D)x70(H) |
